Maples PPD 120XL Mini Intelligent Remove Welding Platform Desoldering Demolition Rework Station For IPhone X Upper / Lower Logic Board CPU NAND IC

Maples PPD 120XL Mini Intelligent Remove Welding Platform Desoldering Demolition Rework Station for iPhone X  Upper / Lower Logic Board CPU NAND IC . No need the hot Air Rework station, working on 230℃, professional tool for repair iPhone X logic board in fast and efficient method

Temperature setting parameters:

• Demolition shield temperature adjustment 180℃-220℃
• In addition to CPU side glue temperature 180℃-220℃
• Demolition A11 CPU the temperature 230℃-240℃
• Desmearing temperature 180℃-200℃
• Reball BGA chip temperature 180℃-200℃
• Soldering A11 CPU temperature 190℃-210℃