New Style 3D BGA planting Stencil: Stepped groove / easy to use / Accuratea Lignment
1.Stepped groove design enables stencil to align with tinning position of IC rapidly.
2.The square holes design makes it easier to take out the formed solder balls.
3.This 3D stencil is easy to use no matter you are a new or expert.
4.High success rate of planting tin,the solder balls can be formed once after you are proficient.
5.This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
Option 1: MJ 3D A8 For iphone 6 6P
Option 2: MJ 3D A9 For iphone 6S 6SP
Option 3: MJ 3D A10 For iphone 7 7P
Option 4: MJ 3D A11 For iphone 8 8P X
