Maples PPD 120X Mini Intelligent Remove Welding Platform Desoldering Demolition Rework Station For IPhone X Middle Frame Middle Level Layer Board Separate
Maples PPD 120X Mini Intelligent Remove Welding Platform Desoldering Demolition Rework Station for iPhone X Middle Frame Middle Level Layer Board Separate . No need the hot Air Rework station, working on 230℃, Separate the iPhone X upper / lower logic board by PPD120X Pre-heating Rework Station, professional tool for repair iPhone X logic board in fast and efficient method, two color for choose
Temperature setting parameters:
- Demolition shield temperature adjustment 180℃-220℃
- In addition to CPU side glue temperature 180℃-220℃
- Demolition A11 CPU the temperature 230℃-240℃
- Desmearing temperature 180℃-200℃
- Reball BGA chip temperature 180℃-200℃
- Soldering A11 CPU temperature 190℃-210℃
