QianLi iPinch 360° Turntable Universal Mainboard PCB Holder FixtureFeature:Design of chuck drive structure, 360° controllable turntable, universal 99% mobile phone motherboard.Mainboards or chips with a width less than 54mm can be clamped,Chuck movement, silent needle roller bearingsChip positioning..
QianLi High-Quality 936 Lead-free Solder Iron TipFeature:Applicable to different IC chips, CPU glueGood heat conduction, fast heating, long lifeHigh density, high-quality iron platingAnti-rust, high wear resistance, high hardnessAnti-corrosion, anti-oxidationBright and free of impuritiesTwo sizes fo..
QianLi Communication Baseband Module 3D BGA Reballing Black Stencil for iPhone 8 / 7 / 6S / 6 / 5SPackage include:1 x Communication BaseBand Module 3D Black Stencil..
QianLi 4in1 3Pin Extension Universal Power CableFeatures:4 in 1 design to solves the problem of wire confusion, insufficient socket, etc.The wire is 0.75 square meters of 3-core pure copper wire, the length of which is 1meterThe interface is universal, suitable for high power stabilized voltage powe..
QianLi 3in1 Middle Frame Reballing Platform BGA Reballing Fixture for iPhone X Xs Xs Max motherboard logic board dissembling and assembling soldering testing tool.Feature:Submit for iPhone X Xs Xs MaxStencils won't deform under high temperatureStrong Magnetic attractionUnique design, Precise positio..
MEGA-IDEA Hot Stone preheating platform is used for removing IC glue, such as CPU, Nand flash, etc. Glue Removing Station for iPhone A10/A11/A12/A13 CPU, iPhone 7- 11 Pro Max NAND Flash, iPhone 7 7P 8 8P fingerprint cable, and other small chips. FeaturesConstant temperature: 220 ℃ ~ 240 ℃Copper heat..
Medusa Pro II Socket Set allows Medusa Pro II users to work with UFS and eMMC flash memoryThis set includes:UFS BGA-095 Socket AdapterUFS BGA-153 Socket AdaptereMMC 4 In 1 Socket AdapterBGA 221BGA 162/186BGA 153/169BGA 529Package Content:eMMC 4 In 1 Socket Adapter – 1 pc.UFS BGA-095 Socket Adapter -..
Medusa PRO II Box is a brand new version of the professional phone flashing and unlocking tool intended for a wide range of Samsung, Huawei, LG, Lenovo, Motorola, Oppo, Sony, Xiaomi, ZTE, and other devices through USB, UFS and MMC interfaces. The main intended purpose of Medusa PRO II Box is repairi..
JC BGA110 NAND Reading / Re-Writing Programmer Module (Need Remove IC) for iPhone 8 / 8 Plus / X / XR / Xs / Xs Max / 11 / 11 Pro / 11 Pro Max / Air 3 / mini 5, need use with the JC PRO1000S Programmer Features:Support for iPhone 8 / 8 Plus / X / XR / Xs / Xs Max / 11 / 11 Pro / 11 Pro Max / Air 3 /..
JC P11 1 3in1 BGA110 PCIE Programmer for iPhone 8 / 8 Plus / X / XR / Xs / Xs MaxFeatures:BGA110 Programmer - JC P11Support 8-XS Max currently, upgrade to support 11-11Pro Max by 2020Brand-new BGA110 NAND no need restoring device firmware, support NAND SYSCFG data modification & write and unbind WIF..
ICFREIND EMMC 13-in-1 Adapter is designated for direct EMMC memory chips connection with the wide range of supported BGA types.It is compatible with all most known EMMC boxes: Riff, RIFF 2, ATF, Z3X Easy Jtag, Z3X Easy Jtag Plus, Medusa Pro.Compatible Boxes:Medusa Pro BoxOctoplus Pro BoxZ3X Easy Jta..
BGA221/BGA254 eMMC/eMCP Socket + USB3.0 SuperSpeed uSD/eMMC Reader + UFI ISP Adapter For GRT Dongle, Support 221-FBGA,254-FBGA; GRT Dongle Pro Qualcomm Tools Remove FRP IMEI for OPPO VIVO Huawei Lenovo XiaoMi Support ALL Qualcomm CPU, Package include:1 x BGA221/BGA254 eMMC/eMCP Socket1 x USB3.0 Supe..
B&R 3in1 Chip Dismantle BGA CPU Scraper Shovel Glue Pry Knife, Professional repair toolset for mobile phone CPU disassemble, It can be used to separate the welding spot, Good for BGA repair, dismantling phone IC chip. Specification:Material: Alloy steel, Metal Handle length: 135 mm Package includes..
Amaoe High-Precision Anti-Rust Anti-Slip 3D Screwdriver Feature:Handle material: aviation aluminum alloyBit material: chrome-molybdenum steelPrecision 3D screwdriver bit, strong magnetic adsorption, tight seam, efficient solution to the problem of sliding wireAviation aluminum handle, anti-slip and ..
2UUL 3in1 Repair Jig for Phone Back Cover MainboardFeatures:New design fixed screen holder.Make your repair work easier.A good tool for a repair store.Easy to handle, use the screw to adjust the widthSize: 14.5cm *15 cmCompatible for the phone cover, mainboard, and etcPackage includes:1 x Repair Jig..
R-SIM15 is the world's first universal dual-cor & dual-CPU iOS13 system unlock card. The original dual CPU and hand-pinch design make R-SIM15 compatible with almost unlock iPhone11 PRO MAX, 11PRO, 11, X, XS, 8, 8PLUS, 6 (not support for iPhone 7 Plus / iPhone 7).If the traditional unlock card was ..