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XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM

XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
XZZ L2023 Intelligent Desoldering Station for iPhone X-14PM
  • Stock: In Stock
  • Model: XZZ L2023
  • Weight: 1.20kg
$72.00
This product has a minimum quantity of 2

Features:

  • XZZ L2023 intelligent desoldering station, no damage to the motherboard, accurate temperature control
  • When the preset temperature is reached, the beeping alarm will be turned on to prevent overheating damage to the motherboard
  • Large operating area, good compatibility, support for larger motherboard desoldering operations, more convenient and fast
  • Clearly display the temperature, up and down temperature control at any time
  • With fast temperature rise, long life, uniform temperature, fast and low thermal complementary growth characteristics
  • Support Android and iPhone X-14 series motherboard lamination separation, screen bracket separation, etc., subsequent continuous updates
  • Extra large heating area, support for Android phones, large operating area, good compatibility, support for larger motherboard desoldering operations, more convenient and fast
  • An intelligent desoldering station, with fast heating, long life, and uniform temperature characteristics, perfect the appearance of the air duct design is more conducive
  • to heat dissipation
  • Innovative design, strong magnetic adsorption, built-in multiple strong magnetic, no snaps, easy to pick up, easy to disassemble
  • Synthetic stone compression clasp, makes the motherboard fit better

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