WL HT007 Intelligent Pre-Heating Platform Motherboard Middle Frame Layered Separater For iPhone X-13 mini/14 Pro max Soldering Station
- Stock: In Stock
- Model: WL-HT007
- Weight: 1.20kg
$294.00
This product has a minimum quantity of 4
FUNCTION:
For iPhone Motherboardheating layered module,design only heats the center column and does not hurt other ICs.Support motherboard layering, tin planting, bonding, edge glue removal.
SUPPORT MODEL:
X-XS-XS Max
X-11Pro Max
11-11Pro-11Pro Max
13mini-13Pro
12mini-12Pro Max
13-13Pro Max