Menu
Your Cart

WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus

WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus
WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus
WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus
WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus
WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus
  • Stock: In Stock
  • Model: WL High-Quality NAND Baseband
  • Weight: 0.10kg
Based on 0 reviews. - Write a review
$12.25
Add to Cart
Buy Now Ask Question
Add to Wish List Compare this Product

IC Chip BGA Reballing Stencil Tin Steel Net for iPhone 6 6Plus, iPhone HDD Nand / Baseband Repair BGA Reballing Net
With Fixed Plate, Easy to use and more accurate IC welding position

Package include:
1 x Steel Net
1 x Fixed Plate

Write a review

Note: HTML is not translated!
Bad Good
Captcha
Tags: WL High-Quality NAND Baseband IC Chip BGA Reballing Stencil Plant Tin Steel Net With Fixed Plate For IPhone 6 6Plus