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IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning

 IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning
 IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning
 IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning
 IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning
 IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning
 IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning
IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning
  • Stock: In Stock
  • Model: IPX 3D BGA Reballing Stencil: GROOVED Positioning & Tinning
  • Weight: 0.12kg
$15.00

3D-X Plus Motherboard Middle Layering Repair Postitioning Slot Plate Tin Fixture For IPhone X


Feature:

  • Made of high temperature resistant synthetic stone
  • 0.3mm thickness, easy to scrape tim, high stength, not easy to deform
  • Durable, easier to take off the net, more efficient
  • Mini size, can put under microscope for use,easy to observe
  • 3D Design,stable use, precise plate tin

Package include: 
1 x Holder
1 x Stencil

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